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Feature Summary
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General
- PICMG® CompactPCI® Serial standard (CPCI-S.0) peripheral slot card
- Single size Eurocard 3U 4HP 100x160mm2
- CompactPCI® Serial backplane connector P1
- Suitable for PCIe® x1 or x2 Gen2 enabled peripheral slots
- On-board PCIe® packet switch PEX8605
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USB Controllers
- 2 x Texas Instruments PCI Express® to quad-port USB 3.0 controller TUSB7340
- PCI Express® x 1 Gen2 interface
- USB 3.0 xHCI (eXtensible host controller interface) SuperSpeed supported
- USB 2.0 high-speed, full-speed, low-speed supported
- USB 3.0 & USB 2.0 for M.2 WWAN module sockets
- USB 2.0 for soldered WWAN modules
- Drivers available for download
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M.2 Sockets
- 4 x M.2 sockets, for 30mm x 42mm cards, B-key
- Socket 2 WWAN configuration according to PCI Express M.2 Specification Rev. 1.1 2016
- USB controlled host I/F, USB 3.0 and USB 2.0
- Future proof by USB 3.0 SuperSpeed, maximum data rate 5Gbps full duplex
- Legacy compliant 2G/3G/4G (LTE) by USB 2.0 480Mbps
- +3.3V power supply, 3.7A typ. current limited electronic power switches, option I2C controlled M.2 socket power on/off
- F/P Mini SIM card holder associated to each socket (default configuration), 2 x dual-slot
- Suitable for 25mm x 15mm 2FF UICC, often referred to as 'Standard SIM'
- Front panel screw lock solution available for Mini SIM cards
- Analog crosspoint switches provided for SIM card sockets, optional selection between front slots and on-board sockets via I2C programming
- Front panel LED array associated to M.2 modem LED outputs (with SPY-0200-RIG only)
- Common F/P antenna connector SMA for simplified external antenna cabling
- Custom specific F/P design for additional pigtail antenna connectors (8HP/12HP width)
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Soldered WWAN Modules
- 4 x Telit HE910-GL quad band 3G embedded modules (global use version)
- DHSPA+ upload 5.76Mbps, download 7.2Mbps
- UMTS/HSPA MHz 800/850, 900, AWS1700, 1900, 2100
- On-board Micro SIM card holder associated to each module (default assignment)
- Analog crosspoint switches provided for SIM card sockets, optional selection between front slots and on-board sockets via I2C programming
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R/F Combiner/Splitter Circuit
- Mini-Circuits SEPS-8-272+, on-board soldering, 8:1
- 700-2700MHz, 50 Ohm
- Isolation 20dB typ.
- Insertion loss 10.8dB typ. 900-2400MHz
- On-board R/F strapping from M.2 WWAN modules (main antenna connector) to combiner/splitter via e.g. Hirose W.FL or I-PEX MHF4 or Murata HSC (2x2mm2) coaxial connectors and cable assemblies
- Combiner/splitter bypassing option w. pigtail antenna connectors (custom specific F/P required e.g. 8HP width)
- On-board R/F routing from soldered WWAN modules to combiner splitter
- RF SMA front panel connector 1 (main antenna)
- Option additional combiner/splitter for 8 x diversity antenna module I/O (7 x EP2W+, with SPY-0100-RIG only)
- Option auxiliary SMA front panel connector 2 (diversity antenna, with SPY-0100-RIG only)
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Applications
- WWAN e.g. 3G/4G/LTE with data transfer rate aggregation
- Railway, transportation
- Industrial IoT networking
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Regulatory, Environment
- Designed & manufactured in Germany
- ISO 9001 certified quality management system
- Long term availability
- Rugged solution - coating, sealing, underfilling on request
- RoHS compliant
- Operating temperature -40°C to +85°C (industrial temperature range)
- Storage temperature -40°C to +85°C, max. gradient 5°C/min
- Humidity 5% ... 95% RH non condensing
- Altitude -300m ... +3000m
- Shock 15g 0.33ms, 6g 6ms
- Vibration 1g 5-2000Hz
- MTBF 26.4 years (carrier board w/o WWAN modules)
- EC Regulatory EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
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